SUBSTITUTES
Alternative producers in overlapping segments/subsegments — ranked by lower chokepoint score. Sanctioned peers sink to the bottom.
SEMES
Keys: equipment front end · equipment front end/etch · equipment front end/cleaning · equipment back end · equipment back end/assembly packaging equipment
| Candidate | Country | Score | Verdict | Overlap | |
|---|---|---|---|---|---|
| ClassOne Technology | United States | 26 | CLEAR | equipment front end/cleaning | Compare › |
| ACM Research | United States | 27 | CLEAR | equipment front end/cleaning | Compare › |
| Plasma-Therm | United States | 27 | CLEAR | equipment front end/etch | Compare › |
| Oxford Instruments | United Kingdom | 31 | CLEAR | equipment front end/etch | Compare › |
| PSK Inc | South Korea | 31 | CLEAR | equipment front end/etch, equipment front end/cleaning | Compare › |
| KCTECH | South Korea | 31 | CLEAR | equipment front end/cleaning | Compare › |
| Nordson | United States | 31 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| Hitachi High-Tech | Japan | 34 | CLEAR | equipment front end/etch | Compare › |
| Tokyo Seimitsu (Accretech) | Japan | 35 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| SUSS MicroTec | Germany | 36 | CLEAR | equipment back end/assembly packaging equipment | Compare › |
| Applied Materials | United States | 37 | CLEAR | equipment front end/etch | Compare › |
| Lam Research | United States | 37 | CLEAR | equipment front end/etch, equipment front end/cleaning | Compare › |