ENTITY · plasma_therm
Plasma-Therm
United States·etch·niche
Plasma etch and deposition systems for specialty and compound-semi devices.
CLEAR · 0–39
27/100 illustrative
Underwriting Thesis
CLEAR — Plasma-Therm: criticality to DoD-exposed downstream programs compounded by sole-source / single-point-of-failure dominance in etch. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration3
Sole-Source Dependence58
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BPlasma-Therm → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MPlasma-Therm → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MPlasma-Therm → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MPlasma-Therm → Win Semiconductors → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 10
- Win SemiconductorsTaiwanCHOKEPOINT
- QorvoUnited StatesDOMESTIC
- Skyworks SolutionsUnited StatesDOMESTIC
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC