ENTITY · applied_materials
Applied MaterialsAMAT
United States·deposition·leader·$490.0B mkt cap
Broadest wafer fab equipment maker, leading in deposition and implant.
CLEAR · 0–39
37/100 illustrative
Underwriting Thesis
CLEAR — Applied Materials: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in deposition. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence80
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
depositionetchion implantmetrology inspectioncmp planarization
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BApplied Materials → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MApplied Materials → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MApplied Materials → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MApplied Materials → TSMC → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 12
- MKS InstrumentsUnited StatesDOMESTIC
- Advanced EnergyUnited StatesDOMESTIC
- VAT GroupSwitzerlandALLIED
- Comet GroupSwitzerlandALLIED
- HoribaJapanALLIED
- Ultra Clean HoldingsUnited StatesDOMESTIC
- Ichor HoldingsUnited StatesDOMESTIC
- EbaraJapanALLIED
- Brooks AutomationUnited StatesDOMESTIC
- FerrotecJapanALLIED
- Pfeiffer VacuumGermanyALLIED
- Atlas CopcoSwedenALLIED
Key Customers · downstream · 8
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- Micron TechnologyUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- CHOKEPOINT
- GlobalFoundriesUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY