ENTITY · classone
ClassOne Technology
United States·cleaning·niche
Wet-processing and electroplating tools for 200mm and specialty fabs.
CLEAR · 0–39
26/100 illustrative
Underwriting Thesis
CLEAR — ClassOne Technology: criticality to DoD-exposed downstream programs compounded by sole-source / single-point-of-failure dominance in cleaning. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration3
Sole-Source Dependence54
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
cleaningdeposition
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BClassOne Technology → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MClassOne Technology → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MClassOne Technology → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MClassOne Technology → TSMC → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 7
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC