CHOKEPOINTIndustrial Battlespace / Common Operating Picture

MIXEDData as of 2026-10-05---- -- -- --:--:-- UTC

COMMODITIES

Segment / subsegment chokepoint rollups — adversary concentration, producer scarcity, sanctions density, and DoD-path exposure. Any hostile producer forces CRITICAL.

57

Subsegments

23

Critical

0

Degraded

69

All keys

Commodity register

Concentration heatmap ›

57/57

Commodity	Score	Verdict	Producers	Adversary%	Scarcity	Sanctions	DoD path	Top tracks
gpu ai accelerators design fabless	40	CRITICAL	27	33	55	42	28	NVIDIA AMD HiSilicon
lithography equipment front end	34	CRITICAL	7	14	63	34	28	Shanghai Micro Electronics (SMEE)ASML Carl Zeiss SMT
mobile soc design fabless	34	CRITICAL	4	50	30	45	0	HiSilicon MediaTek UNISOC
pure play foundry	33	CRITICAL	14	21	30	27	63	Hua Hong Semiconductor SMIC TSMC
eda software eda ip	30	CRITICAL	9	22	23	31	49	Empyrean Technology Primarius Technologies Siemens EDA
cpu design fabless	30	CRITICAL	11	45	8	56	0	StarFive AMD Loongson Technology
hyperscaler ai datacenter	29	CRITICAL	8	25	17	45	28	Alibaba Group Tencent Microsoft
custom silicon design fabless	27	CRITICAL	18	22	1	42	49	Marvell Technology Broadcom Faraday Technology
cmp planarization equipment front end	25	NOMINAL	4	25	47	0	28	Hwatsing Technology Applied Materials Ebara
design services distribution misc	25	NOMINAL	3	33	61	0	0	VeriSilicon Sondrel PDF Solutions
assembly test osat	25	CRITICAL	21	14	15	30	49	JCET Group Huatian Technology ASE Technology
etch equipment front end	24	CRITICAL	10	20	11	40	28	NAURA Technology AMEC (Advanced Micro-Fabrication)Applied Materials
cleaning equipment front end	24	CRITICAL	10	20	11	40	28	NAURA Technology Kingsemi Lam Research
photonics optics distribution misc	24	CRITICAL	23	13	18	24	49	InnoLight Technology Eoptolink Technology Accelink Technologies
dram memory	22	CRITICAL	6	17	32	37	0	ChangXin Memory (CXMT)Samsung Electronics SK hynix
advanced packaging osat	22	NOMINAL	4	0	47	0	49	ASE Technology Amkor Technology Nepes
ion implant equipment front end	21	NOMINAL	3	0	61	0	28	Applied Materials Sumitomo Heavy Industries Axcelis Technologies
ai lab ai datacenter	21	CRITICAL	12	17	6	37	28	Baidu Tencent OpenAI
metrology inspection equipment front end	19	CRITICAL	15	13	3	33	28	Zhongke Feice Technology SiCarrier Lasertec
test equipment equipment back end	19	CRITICAL	12	17	6	28	28	Beijing Huafeng Test & Control (AccoTest)Hangzhou Changchuan Technology Chroma ATE
controllers memory	19	NOMINAL	2	0	78	0	0	Phison Electronics Silicon Motion
deposition equipment front end	18	CRITICAL	17	12	2	32	28	NAURA Technology Piotech AIXTRON
nand memory	18	CRITICAL	7	14	22	34	0	Yangtze Memory (YMTC)Samsung Electronics SK hynix
specialty memory memory	18	NOMINAL	7	43	22	0	0	GigaDevice Semiconductor Ingenic Semiconductor Giantec Semiconductor
power analog power rf	17	NOMINAL	36	22	20	0	28	Silan Microelectronics Sumitomo Electric Industries Innoscience
probe cards equipment back end	17	NOMINAL	4	0	47	0	28	MPI Corporation Technoprobe Leeno Industrial
specialty gases materials	16	CRITICAL	14	7	4	27	28	Jiangsu Nata Opto-electronic Material (Nanda Optoelectronic)Air Liquide Linde
networking systems ai datacenter	16	CRITICAL	16	19	2	39	0	Huawei ZTE New H3C
bonders equipment back end	15	NOMINAL	5	0	37	0	28	ASMPT Kulicke & Soffa BE Semiconductor Industries
networking silicon design fabless	15	NOMINAL	16	6	2	0	63	Marvell Technology Broadcom NVIDIA
foundry services foundry	15	NOMINAL	3	0	61	0	0	Intel Samsung Electronics Polar Semiconductor
emerging memory memory	15	NOMINAL	3	0	61	0	0	Weebit Nano Ferroelectric Memory Company Everspin Technologies
silicon wafers materials	14	NOMINAL	13	15	15	0	28	National Silicon Industry Group GlobalWafers Wafer Works
subsystems components equipment front end	14	CRITICAL	18	6	1	26	28	SiCarrier VAT Group Atlas Copco
photoresists chemicals materials	13	CRITICAL	31	6	0	23	28	Jiangsu Nata Opto-electronic Material (Nanda Optoelectronic)Suzhou Crystal Clear Chemical (Jingrui)Shin-Etsu Chemical
analog mixed signal analog power rf	13	NOMINAL	37	30	16	0	0	NXP Semiconductors Will Semiconductor (OmniVision)Sino Wealth Electronic
substrates materials	12	NOMINAL	24	13	11	0	28	Shengyi Technology Shennan Circuits Kingboard Holdings
ip licensing eda ip	12	NOMINAL	26	8	0	0	49	StarFive Faraday Technology Achronix
fpga design fabless	12	NOMINAL	7	14	31	0	0	AMD Gowin Semiconductor Achronix
hbm memory	12	NOMINAL	3	0	48	0	0	Samsung Electronics SK hynix Micron Technology
systems odm distribution misc	12	CRITICAL	14	14	4	27	0	Inspur Lenovo Hon Hai (Foxconn)
data center reit ai datacenter	12	NOMINAL	6	17	29	0	0	GDS Holdings Equinix Digital Realty
sputtering targets materials	11	NOMINAL	10	10	11	0	28	Solar Applied Materials Ningbo Jiangfeng Electronic Material (Konfoong)JX Advanced Metals
assembly packaging equipment equipment back end	11	NOMINAL	7	0	22	0	28	ASMPT TOWA DISCO
edge iot soc design fabless	11	NOMINAL	24	38	0	0	0	GigaDevice Semiconductor Ingenic Semiconductor Espressif Systems
idm idm	11	NOMINAL	22	18	1	0	28	NXP Semiconductors Intel Silan Microelectronics
colocation ai datacenter	11	NOMINAL	37	5	36	0	0	Applied Digital IREN Chindata Group
cmp slurries materials	10	NOMINAL	8	0	17	0	28	Fujimi Incorporated Tokuyama FUJIFILM
photomasks materials	10	NOMINAL	8	0	17	0	28	Taiwan Mask Corporation HOYA TOPPAN Holdings
packaging materials materials	9	NOMINAL	9	0	14	0	28	Chang Wah Technology Mitsui High-tec Tanaka Precious Metals
distributors distribution misc	7	NOMINAL	12	0	6	0	28	WPG Holdings WT Microelectronics Supreme Electronics
neocloud ai datacenter	7	NOMINAL	13	0	5	0	28	CoreWeave Applied Digital IREN
rf analog power rf	6	NOMINAL	10	10	11	0	0	Win Semiconductors Maxscend Microelectronics Airoha Technology
passives analog power rf	6	NOMINAL	6	0	22	0	0	Yageo Walsin Technology Chilisin Electronics
modules memory	4	NOMINAL	8	0	17	0	0	ADATA Technology Kingston Technology Team Group
display ics design fabless	2	NOMINAL	11	0	8	0	0	Novatek Microelectronics Raydium Semiconductor Himax Technologies
power thermal ai datacenter	1	NOMINAL	14	0	4	0	0	Delta Electronics Lite-On Technology Schneider Electric