ENTITY · disco
DISCO6146
Japan·assembly packaging equipment·leader·$57.1B mkt cap
Controls most of the market for wafer dicing and grinding equipment.
CLEAR · 0–39
38/100 illustrative
Underwriting Thesis
CLEAR — DISCO: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in assembly packaging equipment. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence82
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BDISCO → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MDISCO → ASE Technology → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MDISCO → ASE Technology → Valens Semiconductor
- Scale AI · 3 hops · $105.6MDISCO → ASE Technology → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 9
- ASE TechnologyTaiwanCHOKEPOINT
- Amkor TechnologyUnited StatesDOMESTIC
- TSMCTaiwanCHOKEPOINT
- SK hynixSouth KoreaALLIED
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC