ENTITY · tokyo_seimitsu
Tokyo Seimitsu (Accretech)7729
Japan·assembly packaging equipment·major·$5.0B mkt cap
Wafer dicing, grinding, and metrology equipment maker.
CLEAR · 0–39
35/100 illustrative
Underwriting Thesis
CLEAR — Tokyo Seimitsu (Accretech): sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in assembly packaging equipment. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence71
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
assembly packaging equipmentmetrology inspection
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BTokyo Seimitsu (Accretech) → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MTokyo Seimitsu (Accretech) → ASE Technology → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MTokyo Seimitsu (Accretech) → ASE Technology → Valens Semiconductor
- Scale AI · 3 hops · $105.6MTokyo Seimitsu (Accretech) → ASE Technology → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 9
- ASE TechnologyTaiwanCHOKEPOINT
- Amkor TechnologyUnited StatesDOMESTIC
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC