CHOKEPOINT
MIXEDGraph 2026-08-10---- -- -- --:--:-- UTC
ENTITY · ase

ASE TechnologyASX

Taiwan·assembly test·leader·$89.0B mkt cap

World's largest OSAT, includes SPIL; key advanced packaging partner.

WATCH · 40–69
54/100 illustrative
Underwriting Thesis

WATCH — ASE Technology: sole-source / single-point-of-failure dominance compounded by concentrated foreign-origin supply in assembly test. A chokepoint underwriting concern at this tier.

Factor Breakdown
Foreign-Origin Concentration69
Sole-Source Dependence86
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure

Entity not present on tracked screening lists (CSL).

DoD Exposure

No matched DoD semiconductor awards (USASpending) for this entity.

Segments
assembly testadvanced packaging
Shortest paths → DoD-exposed firms
  • Marvell Technology · 1 hop · $184.3M
    ASE Technology → Marvell Technology
  • Valens Semiconductor · 1 hop · $28.3M
    ASE Technology → Valens Semiconductor
  • Scale AI · 2 hops · $105.6M
    ASE Technology → NVIDIA → Scale AI
  • GlobalFoundries · 3 hops · $1.05B
    ASE Technology → Broadcom → Furukawa Electric → GlobalFoundries
Chokepoint Relationships

Key Suppliers · upstream · 16

Key Customers · downstream · 7

Data Provenance· generated 2026-08-10 01:06:49Z
  • Consolidated Screening List (CSL) [LIVE] https://data.trade.gov/downloadable_consolidated_screening_list/v1/consolidated.json @ 2026-08-10T01:06:49.039Z
  • USASpending.gov — DoD award search [LIVE] https://api.usaspending.gov/api/v2/search/spending_by_award/ @ 2026-08-10T01:06:49.377Z
  • Curated ownership aggregation [FALLBACK] @ 2026-08-10T01:06:49.378Z
  • Curated China-ecosystem + Nexperia edges (Phase B, CSET ETO + TechInsights + TrendForce + SCMP + BIS Entity List + Nexperia press release) [FALLBACK] @ 2026-08-10T01:06:49.378Z

Firm/commodity-level signals from public data — not component-level BOM. Scores are an analytic underwriting heuristic, not legal or procurement advice.