ENTITY · asmpt
ASMPT0522
Singapore·assembly packaging equipment·leader·$11.2B mkt cap
Largest back-end assembly and packaging equipment maker; TCB leader.
CLEAR · 0–39
39/100 illustrative
Underwriting Thesis
CLEAR — ASMPT: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in assembly packaging equipment. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence85
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
assembly packaging equipmentbonders
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BASMPT → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MASMPT → ASE Technology → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MASMPT → ASE Technology → Valens Semiconductor
- Scale AI · 3 hops · $105.6MASMPT → ASE Technology → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 13
- ASE TechnologyTaiwanCHOKEPOINT
- Amkor TechnologyUnited StatesDOMESTIC
- JCET GroupChinaHostileADVERSARY
- CHOKEPOINT
- ADVERSARY
- Huatian TechnologyChinaHostileADVERSARY
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC