ENTITY · suss_microtec
SUSS MicroTecSMHN
Germany·assembly packaging equipment·major·$2.5B mkt cap
Packaging lithography, coaters and bonders for advanced packaging.
CLEAR · 0–39
36/100 illustrative
Underwriting Thesis
CLEAR — SUSS MicroTec: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in assembly packaging equipment. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence74
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BSUSS MicroTec → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MSUSS MicroTec → ASE Technology → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MSUSS MicroTec → ASE Technology → Valens Semiconductor
- Scale AI · 3 hops · $105.6MSUSS MicroTec → ASE Technology → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 13
- ASE TechnologyTaiwanCHOKEPOINT
- Amkor TechnologyUnited StatesDOMESTIC
- JCET GroupChinaHostileADVERSARY
- CHOKEPOINT
- ADVERSARY
- Huatian TechnologyChinaHostileADVERSARY
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC