ENTITY · tongfu
Tongfu Microelectronics002156
China·assembly test·major·$15.3B mkt cap
Chinese OSAT and AMD's main packaging partner via JV fabs.
WATCH · 40–69
49/100 illustrative
Underwriting Thesis
WATCH — Tongfu Microelectronics: concentrated foreign-origin supply compounded by sole-source / single-point-of-failure dominance in assembly test. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration69
Sole-Source Dependence65
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Shortest paths → DoD-exposed firms
- Scale AI · 2 hops · $105.6MTongfu Microelectronics → NVIDIA → Scale AI
- GlobalFoundries · 3 hops · $1.05BTongfu Microelectronics → Broadcom → Furukawa Electric → GlobalFoundries
- Marvell Technology · 3 hops · $184.3MTongfu Microelectronics → Broadcom → InnoLight Technology → Marvell Technology
- Valens Semiconductor · 4 hops · $28.3MTongfu Microelectronics → Broadcom → Furukawa Electric → TSMC → Valens Semiconductor
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 8
- Mitsui High-tecJapanALLIED
- Chang Wah TechnologyTaiwanCHOKEPOINT
- ALLIED
- ASMPTSingaporeALLIED
- Kulicke & SoffaSingaporeALLIED
- TOWAJapanALLIED
- SUSS MicroTecGermanyALLIED
- CohuUnited StatesDOMESTIC