ENTITY · ulvac
ULVAC6728
Japan·deposition·major·$3.1B mkt cap
Vacuum equipment maker; sputtering and deposition systems for semis.
CLEAR · 0–39
34/100 illustrative
Underwriting Thesis
CLEAR — ULVAC: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in deposition. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence67
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
depositionsubsystems components
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BULVAC → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MULVAC → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MULVAC → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MULVAC → Samsung Electronics → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 7
- Samsung ElectronicsSouth KoreaALLIED
- SK hynixSouth KoreaALLIED
- TSMCTaiwanCHOKEPOINT
- IntelUnited StatesDOMESTIC
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC