ENTITY · haesung_ds
Haesung DS195870
South Korea·packaging materials·niche·$0.8B mkt cap
Korean leadframe and package-substrate maker.
CLEAR · 0–39
31/100 illustrative
Underwriting Thesis
CLEAR — Haesung DS: criticality to DoD-exposed downstream programs compounded by sole-source / single-point-of-failure dominance in packaging materials. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration18
Sole-Source Dependence54
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
packaging materialssubstrates
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BHaesung DS → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MHaesung DS → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MHaesung DS → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MHaesung DS → Samsung Electronics → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 7
- Samsung ElectronicsSouth KoreaALLIED
- SK hynixSouth KoreaALLIED
- TSMCTaiwanCHOKEPOINT
- IntelUnited StatesDOMESTIC
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC