ENTITY · element_solutions
Element SolutionsESI
United States·packaging materials·major·$11.2B mkt cap
Specialty chemicals for electronics assembly and advanced packaging.
CLEAR · 0–39
30/100 illustrative
Underwriting Thesis
CLEAR — Element Solutions: sole-source / single-point-of-failure dominance compounded by criticality to DoD-exposed downstream programs in packaging materials. A chokepoint underwriting concern at this tier.
Factor Breakdown
Foreign-Origin Concentration3
Sole-Source Dependence67
Sanctions Exposure0
Downstream Criticality60
Sanctions Exposure
Entity not present on tracked screening lists (CSL).
DoD Exposure
No matched DoD semiconductor awards (USASpending) for this entity.
Segments
packaging materialsphotoresists chemicals
Shortest paths → DoD-exposed firms
- GlobalFoundries · 1 hop · $1.05BElement Solutions → GlobalFoundries
- Marvell Technology · 2 hops · $184.3MElement Solutions → TSMC → Marvell Technology
- Valens Semiconductor · 2 hops · $28.3MElement Solutions → TSMC → Valens Semiconductor
- Scale AI · 3 hops · $105.6MElement Solutions → TSMC → NVIDIA → Scale AI
Possible substitutes · same commodity buckets
Chokepoint Relationships
Key Suppliers · upstream · 0
No mapped upstream suppliers.
Key Customers · downstream · 7
- TSMCTaiwanCHOKEPOINT
- Samsung ElectronicsSouth KoreaALLIED
- IntelUnited StatesDOMESTIC
- SK hynixSouth KoreaALLIED
- Micron TechnologyUnited StatesDOMESTIC
- SMICChinaHostileADVERSARY
- GlobalFoundriesUnited StatesDOMESTIC