CHOKEPOINT
MIXEDGraph 2026-08-10---- -- -- --:--:-- UTC
ENTITY · winbond

Winbond Electronics2344

Taiwan·specialty memory·niche·$31.1B mkt cap

Specialty memory maker: NOR flash and niche DRAM.

WATCH · 40–69
45/100 illustrative
Underwriting Thesis

WATCH — Winbond Electronics: concentrated foreign-origin supply compounded by criticality to DoD-exposed downstream programs in specialty memory. A chokepoint underwriting concern at this tier.

Factor Breakdown
Foreign-Origin Concentration75
Sole-Source Dependence45
Sanctions Exposure0
Downstream Criticality57
Sanctions Exposure

Entity not present on tracked screening lists (CSL).

DoD Exposure

No matched DoD semiconductor awards (USASpending) for this entity.

Segments
specialty memorydram
Shortest paths → DoD-exposed firms
  • Scale AI · 3 hops · $105.6M
    Winbond Electronics → Dell Technologies → CoreWeave → Scale AI
Chokepoint Relationships

Key Suppliers · upstream · 0

No mapped upstream suppliers.

Key Customers · downstream · 4

Data Provenance· generated 2026-08-10 01:06:49Z
  • Consolidated Screening List (CSL) [LIVE] https://data.trade.gov/downloadable_consolidated_screening_list/v1/consolidated.json @ 2026-08-10T01:06:49.039Z
  • USASpending.gov — DoD award search [LIVE] https://api.usaspending.gov/api/v2/search/spending_by_award/ @ 2026-08-10T01:06:49.377Z
  • Curated ownership aggregation [FALLBACK] @ 2026-08-10T01:06:49.378Z
  • Curated China-ecosystem + Nexperia edges (Phase B, CSET ETO + TechInsights + TrendForce + SCMP + BIS Entity List + Nexperia press release) [FALLBACK] @ 2026-08-10T01:06:49.378Z

Firm/commodity-level signals from public data — not component-level BOM. Scores are an analytic underwriting heuristic, not legal or procurement advice.